SAKI 3Si SMT 3D SPI For SMT Machine Line

Model:SAKI 3Di-MS2/AKI 3Di-MD2

Dimensions:M(Single lane/Dual lane)

Machine SizeWxDxH:850×1430×1500

Weight:850kg

Electric Power:Single Phase~200-240V+/-10%,50/60Hz

Air Requirement:0.5MPa,5L/min(ANR)

PCB Size(mm)1:50×60~330×330

PCB Size(mm)2:50×60~330×330/50×60~320×330

PCB Clearance:Top:40mm,Bottom:60mm/Top:40mm,Bottom:50mm.

  • SMT machine line  customer

  • SMT machine line  customer

  • SMT machine line  customer

  • SMT machine line  customer

  • SMT machine line  customer

SAKI 3Si 3D SPI Online SMT Machine SMT 3D SPI SAKI 3D SPI Inline 3D Solder Paste Inspection System SPI Machine In SMT Machine Line

Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15

Whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 

WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .

Also can support some original parts of machine repair.

Successful Experience:

1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World

2. Training More Than 500 Experts and Technician for Customers.

3. Became the Most Reliable Chinese Partner for You.

For SMT Factory Setup, We Can Do for You:

1. We Provide Full SMT Solution for You

2. We Provide Core Technology With Our Equipments

3. We Provide The Most Professional Tech Service

4. We Have Wealthy Experience on SMT Factory Setup

SAKI 3Si SMT LINE 3D SPI Technical Parameters : 

Market Asia Global
Dimensions M
Single lane
M
Dual lane
L
Single lane
L
Dual lane
XL
Single lane
Model  Name 3Di-MS2 3Di-MD2 3Di-LS2 3Di-LD2 3Di-ZS2
Size (W)×(D)×(H)
(mm,in.)
850×1430×1500,
33.46×56.30×59.06
1040×1440×1500,
40.94×56.69×59.06
1340×1440×1500
52.75×56.69×59.06
Weight 850kg,1873.93Ib 900kg,1984.16lb
Electric Power Single Phase~200-240V+/-10%,50/60Hz
Air Requirement 0.5MPa,5L/min(ANR)
PCB Size
(mm,in.)
- Single
mode
Dual
mode
- Single
mode
Dual
mode
-
  50×60~330×330,
1.97×2.36~12.99×12.99
50×60~330×330,
1.97×2.36~12.99×12.99
50×60~320×330,
1.97×2.36~12.60×12.99
7μm  camera  head 7μm  camera  head 50×60~686×870,
1.97×2.36~27.00×34.25
        50×60~330×330,
1.97×2.36~12.99×12.99
50×60~330×330,
1.97×2.36~12.99×12.99
50×60~320×330,
1.97×2.36~12.60×12.99
 
        12/18μm camera head 12/18μm camera head  
        50×60~500×510,
1.97×2.36~19.68×20.07
50×60~500×510,
1.97×2.36~19.68×20.07
50×60~320×510,
1.97×2.36~12.60×20.07
 
PCB Clearance Top:40mm,1.57in.
Bottom:60mm,2.36in.
Top:40mm,1.57in.
Bottom:50mm,1.96in.
Top:40mm,1.57in.
Bottom:60mm,2.36in.
Top:40mm,1.57in.
Bottom:50mm,1.96in.
Top:40mm,1.57in.
Bottom:60mm,2.36in.
SAKI 3Si SMT LINE 3D SPI Details: 

SAKI 3Si 3D Solder Paste Inspection Machine

 

Saki's BF-3Si is one of the world's fastest 2-projector solder paste inspection systems while Saki's Phase Measurement Profilometry with Liquid Crystal on Silicon (LCoS) technology ensures high repeatability of inspection results. Saki's 3D SPI system inspects for: Height, volume, area, bridging, offset, shape. 

Solder paste inspection combines full-color 2D and 3D images and is based on 3D data. The condition of the solder paste is measured and automatically judged in 3D for each pad using Saki's proprietary height measurement technology, Phase Measurement Profilometry with LCoS. Saki's active projection technology projects various lighting patterns to measure all items on a substrate with a height range of 0-500 microns. By switching projection patterns at high speed, in real time, and combining both a narrow and wide range of measurement, Saki's BF-3Si realizes broad dynamic ranges. 

Saki 's unique, state-of the-art 3D measurement technology provides advanced analysis capability, with easy and powerful image-viewing features that allow the user to rotate, enlarge, and reduce images. The system automatically measures warpage at various points across a broad area of the board and optimizes the settings based on the warpage and the printed solder paste thickness to provide the greatest accuracy in warpage measurement and compensation. Program generation is via CAD data. Saki's BF-3Si SPI system also features a high-rigidity gantry for a very solid, accurate, and reliable, high-speed imaging system. 

  • Works with closed circuit analysis method.           
  • High-speed and sensitive inspection capability         
  • Easy analysis of obtained data

Some Process Errors

  • The insufficient soldering ' amount which causes cold solder on the pad catches process error       
  • 'The spread of the solder ' that causes a short circuit fault on the pad captures the operation error 

Feature:

  • Dimensions (mm) : 1040 x 1440 x 1470
  • Weight (kg): 870
  • Electric Power: 200V - 240V+/-10%, 50/60Hz 
  • Power Consumption: 1.3kVA
  • Air Requirement: 0.5 MPa @ ≥5L/min (ANR) 
  • Pcb Size (mm) : 50 W x 60 L - 460 W x 510 L

SAKI 3Si SMT LINE 3D SPI Picture Show:   











EXHIBITION:

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