MIRTEC MS-11E SMT 3D SPI For SMT Machine Line

Model:MS-11e

PCB Size:50x50 to 510x460mm

Vision System (FOV Size):4MP/15MP/25MP

Height Resolution:±1um

Height Accuracy:±1%

Repeatability:Height:±1%/Volume:±2%

Inspection Height:Max.500 um /Mini.40um

Max. PCB Warpage:±2mm

Max. PCB Weight:Standard 4Kg

PCB Thickness Range:Standard 0.5mm-5mm

Dimension(LxDxH):1,080x1470x1,500mm

Weight:Approx.950 kg

  • SMT machine line customer

  • SMT machine line customer

  • SMT machine line customer

  • SMT machine line customer

  • SMT machine line customer

MIRTEC MS-11E SMT Machine SMT 3D SPI MIRTEC 3D SPI Inline 3D Solder Paste Inspection System SPI Machine In SMT Machine Line

Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15

Whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 

WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .

Also can support some original parts of machine repair.

Successful Experience:

1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World

2. Training More Than 500 Experts and Technician for Customers.

3. Became the Most Reliable Chinese Partner for You.

For SMT Factory Setup, We Can Do for You:

1. We Provide Full SMT Solution for You

2. We Provide Core Technology With Our Equipments

3. We Provide The Most Professional Tech Service

4. We Have Wealthy Experience on SMT Factory Setup

MIRTEC MS-11E SMT LINE SPI Technical Parameters : 

Model MS-11e
PCB Inspection Area
MS-11e 50 mm x50 mm to 510 mm x460 mm (2.0"x2.0"to 20.1"x18.1")
MS-11e(Extended PCB Size) 50 mm x50 mm to 510 mm x510 mm (2.0"×2.0"to 20.1"×20.1")
MS-11DL(Dual Lane)
Single Lane:50 mm x50 mm to 460 mm x590 mm (2.0"×2.0"to 20.1"x23.23")
Dual Lane:50 mm x50 mm to 460 mm x300 mm (2.0"×2.0"to 20.1"x11.81")
MS-11em (Small-Footprint) 50 mm x50 mm to 330 mm×280 mm (2.0"×2.0"to 12.99"×11.02")
Vision System (FOV Size)
4MP CameraLink:(2,048×2,048@180 fps)
 Option 1 Pixel Resolution:15 um 32.17 mm x32.17 mm(1.27"x1.27")
Option 2 Pixel Resolution:10 um 24.13 mmx24.13 mm (0.95"x 0.95")
15MP CoaXPress:(3,904×3,904 @120 fps)
 Option 1 Pixel Resolution:15 um 58.56 mm x58.56 mm (2.31"×2.31")
Option 2 Pixel Resolution:10 um 39.04 mm x39.04 mm(1.54"x1.54")
25MP CoaXPress:(5,120×5,120 @72 fps) Option 1 Pixel Resolution:7.7 um 39.42 mm x39.42 mm (1.55"x1.55")
Inspection Technology
3D Inspection Technology Dual Projection Shadow Free Moiré Phase Step Image Processing
2D Inspection Technology 4MP CameraLink/15MP CoaXPress /25MP CoaXPress Camera System
Height Resolution ±1 um
Height Accuracy on Calibration Fixture ±1%
Repeatability on Calibration Fixture Height:±1%/Volume:±2%
Inspection Height Maximum:500 um /Minimum:40um
3D Inspection Item Solder Deposition:Height,Volume /Area,Solder Bridge,X/Y Offset,Shape Deformity,etc.
Additional Specifications
Lens  Configuration Precision Telecentric Compound Lens Design
Lighting System Advanced High-Intensity RGB LED Lighting System.
PCB Surface Clearance Top-Side  Clearance:20  mm  /Bottom-Side  Clearance:50  mm
PCB Edge Clearance Top-Edge  Clearance:3  mm  /Bottom-Edge  Clearance:3.5  mm
Maximum PCB Warpage ±2 mm
Maximum PCB Weight Standard:4 Kg (8.82 Lbs.)
PCB Thickness Range Standard:0.5   mm-5   mm
Robot Positioning System Precision  Closed  Loop  AC  Servo  Drive,Resolution:1  um  /Repeatability:±10  um
Power Requirements Single  Phase 200~240V 50~60Hz;1.1  KW,Breaker Capacity:25 Amp
Air Requirements 5  Kgf /cm²(0.5  Mpa);(71  PSI)
Machine Dimensions and Weight
MS-11e 1,080 mmWx1,470 mm Dx1,500 mm H (42.5"×57.87"×59.1") 950 Kg(2,094 Ibs.)
MS-11DL 1,080 mm Lx1,610 mm Wx1,610 mm H (42.5"×63.39"×63.39") 1.030 Kg (2,270.76 Ibs)
MS-11em 900 mm Lx1,290 mm Wx1,660 mm H(35.43"×50.79"x65.35") 870 Kg (1,918.02 Ibs)
MIRTEC MS-11E SMT LINE SPI Details: 


MIRTEC MS-11E Mirtec MS-11e In Line Solder Paste Inspection System

The Mirtec MS-11e is a high-performance Inline Solder Paste Inspection (SPI) system designed to deliver precise and reliable inspection of solder paste deposits. Ideal for electronics manufacturers who demand accuracy and efficiency, the MS-11e ensures consistent quality control throughout the production process.

  • Exclusive15MP / 25MP CoaXPress Camera System
  • Dual Projection Shadow Free Moiré Technology
  • Precision Compound Telecentric Camera Lens
  • Automated Z-Height Calibration System
  • Automated PCB Under Board Support System
  • Precision PCB Warpage Compensation
  • Closed Loop Communication With Screen Printer
  • Absolute Repeatability and Reproducibility
  • INTELLISYS® Industry 4.0 Intelligent Factory Automation System

Feature:

  • High Speed Precision In-Line SPI System.
  • FOUR or FIFTEEN MEGA PIXEL Digital Camera Technology.
  • Precision TELECENTRIC Compound Lens Design.
  • 10 Micron / Pixel Resolution.
  • 2 Micron Height Accuracy.
  • Volume Repeatability +/- 2%.
  • Extremely Simple Programming and Operation.


MIRTEC MS-11E SMT LINE SPI Picture Show:   











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