MIRTEC MS-15 SMT Machine SMT 3D SPI MIRTEC 3D SPI Inline 3D Solder Paste Inspection System SPI Machine In SMT Machine Line
Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15
Whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 
WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .
Also can support some original parts of machine repair.
Successful Experience:
1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World
2. Training More Than 500 Experts and Technician for Customers.
3. Became the Most Reliable Chinese Partner for You.
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
MIRTEC MS-15 SMT LINE SPI Technical Parameters :
PCB Inspection Area
MS-15
50 mm x50 mm to 510 mm x460 mm (2.0"x2.0"to 20.1"x18.1")
PCB Indexing Mode:50 mm x50 mm to 1,020 mm x460 mm (2.0"×2.0"to 40.16"x18.1")
MS-15U
60 mm x60 mm to 660 mm x610 mm (2.36"x2.36"to 26.0"x24.1")
PCB Indexing Mode:60 mm x60 mm to 1,320 mm x610 mm (2.36"×2.36"to 51.97"×24.1")
MS-15DL (Dual Lane)
Vision System (FOV Size)
15MP CoaXPress:(3,904×3,904 @120 fps)
Option 1
Pixel Resolution:15um
58.56 mm x58.56 mm (2.31”×2.31”)
Option 2
Pixel Resolution:10um
39.04 mm x39.04 mm(1.54”×1.54”)
25MP CoaXPress:(5,120×5,120 @72 fps)
Option 1
Pixel Resolution:7.7um
39.42 mm x39.42 mm(1.55”x1.55”)
Inspection Technology
3D Inspection Technology
Dual Projection Shadow Free Moiré Phase Step Image Processing
2D Inspection Technology
15MP CoaXPress /25MP CoaXPress Camera System
Height Resolution
±1um
Height Accuracy on Calibration Fixture
±1%
Repeatability on Calibration Fixture
Height:±1%/Volume:±2%
Inspection Height
Maximum:500 um /Minimum:40um
3D Inspection Item
Solder Deposition:Height,Volume,Area,Solder Bridge,X/Y Offset,Shape Deformity,etc.
Additional Specifications
Lens Configuration
Precision Telecentric Compound Lens Design
Lighting System
Advanced High-Intensity RGB LED Lighting System.
PCB Surface Clearance
Top-Side Clearance:20 mm /Bottom-Side Clearance:50 mm
PCB Edge Clearance
Top-Edge Clearance:3 mm /Bottom-Edge Clearance:3.5 mm
Maximum PCB Warpage
±2 mm
Maximum PCB Weight
Standard:4 Kg(8.82 Lbs.)
PCB Thickness Range
Standard:0.5mm-5mm
Robot Positioning System
Precision Linear Drive System,Resolution:0.2um /Repeatability:±2um
Power Requirements
Single Phase 200~240V 50~60Hz;1.1KW,Breaker Capacity:25Amp
Air Requirements
5 Kgf /cm²(0.5 Mpa);(71 PSI)
Machine Dimensions and Weight
MS-15
1,250 mm Lx1,500 mm Dx1,600 mm H (49.21"x59.06"x62.99")
1,200 Kg (2,645.55lbs.)
MS-15U
1,400 mm Lx1,650 mm Dx1,600 mm H (55.2"x64.96"x62.99")
1,500 Kg (3,306.93lbs.)
MS-15DL
1,250 mm Lx1,500 mm Dx1,600 mm H (49.21"x59.06"x62.99")
1,400 Kg (3,086.47lbs.)
MIRTEC MS-15 SMT LINE SPI Details:
MIRTEC MS-15 3D In-line SPI
Precision 3D SP for second process of semiconductor manufacturing
In-Line SPI Machine
- High Speed Precision In-Line SPI System
- Exclusive TWENTY-FIVE MEGA PIXEL ISIS® Vision System
- 7.7 Micron / Pixel Precision TELECENTRIC COMPOUND LENS Design
- Advanced Dual Projection SHADOW FREE MOIRÉ Design
- 2 Micron Height Accuracy
- Precision LINEAR DRIVE Motor System
- Extremely Simple Programming and Operation
Feature:
-
The world's best performance 3D SPI
- Super high resolution CXP camera and precision 6um lens
- Solder paste inspection up to 0201(mm) size component pad
- 30um height solder paste inspection
- Shadow-free dual projection 3D measurement
- High accuracy and repeatability with linear motor drive system
- Auto PCB warpage compensation
- Closed-Loop System : Optimize the manufacturing process by connection with Screen Printer and Pick & Place Machine
- Intellisys® : Total process management system for improving productivity and achieving smart factory
- High precision 3D SPI that can be applied to solder paste inspection of semiconductor second process, mini-LED and micro-LED
MIRTEC MS-15 SMT LINE SPI Picture Show:
EXHIBITION:
SMT LINE:
