MIRTEC MV-9 3D AOI SMT LINE AOI 2D Automated Optical Inspection System AOI Equipment AOI Machine For SMT Machine Line SMT Assembly Line
Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15
Whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 
WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .
Also can support some original parts of machine repair.
Successful Experience:
1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World
2. Training More Than 500 Experts and Technician for Customers.
3. Became the Most Reliable Chinese Partner for You.
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
MIRTEC MV-9 3D AOI SMT LINE AOI Technical Parameters:
MODEL
MV-9
PCB Inspection Area
MV-9
50mmx50mmto510mmx460mm(2.0"×2.0"to20.1"x18.1")
PCB Indexing Mode:50mmx50mmto1,020mm×460mm(2.0"×2.0"to40.16"x18.1")
MV-9U
60mmx60mmto660mmx610mm(2.36"×2.36"to26.0"x24.1")
PCB Indexing Mode:60mmx60mmto1,320mmx610mm(2.36"×2.36"to51.97"×24.1")
MV-9DL OMNI(Dual Lane)
Vision System (FOV Size)
15MP CoaXPress:(3,904×3,904 @120 fps)
Option 1
Pixel Resolution:15um
58.56mmx58.56mm(2.31”×2.31”)
Option 2
Pixel Resolution:10um
39.04mmx39.04mm(1.54”x1.54”)
25MP CoaXPress:(5,120×5,120 @72 fps)
Option 1
Pixel Resolution:7.7um
39.42mmx39.42mm(1.55”X1.55”)
OMNI-VISION Inspection Technology
3D Inspection Technology
Digital Tri-Frequency Moiré Technology-12 Projection Blue DLP
2D Inspection Technology
15MP/25MP CoaXPress Camera System
Maximum 3D Inspection Height
25mm @±3um
2D Inspection Item
Missing Component,Wrong Component,Mis-Alignment,Skewed Component,Polarity,Tombstone,Solder Bridge,Flipped Device,Solder Ball,Etc
3D Inspection Item
Component Height,Position,Lifted Package,Lifted Lead,Solder Fillet,Excessive Solder,Insufficient Solder,Solder Bridge,Open Solder,Etc
Additional Specifications
Lens Configuration
Precision Telecentric Compound Lens Design
Lighting System
Eight Phase Color Lighting
SIDE-VIEWERO Camera System
PCB Surface Clearance
Top-Side Clearance:45mm /Bottom-Side Clearance:50mm
PCB Edge Clearance
Top-Edge Clearance:3mm /Bottom-Edge Clearance:3.5mm
Maximum PCB Warpage
±2mm
Maximum PCB Weight
Standard:4Kg(8.82 Lbs.)
PCB Thickness Range
Standard:0.5mm-3mm /Optional:0.5mm-5mm
Minimum Component Inspection
0402Chip (mm)/01005Chip (in)/0.3Pitch (mm)
Robot Positioning System
Precision Linear Drive System,Resolution:0.2 um /Repeatability:±2 um
Power Requirements
Single Phase 200~240V 50~60Hz;1.1 KW,Breaker Capacity:25 Amp
Air Requirements
5Kgf /cm²(0.5 Mpa);(71 PSI)
Machine Dimensions and Weight
MV-9
1,250mmLx1,500mmDx1,600mmH(49.21"x59.06"x62.99")/1,200Kg(2,645.55lbs.)
MV-9U
1,400mmLx1,650mmDx1,600mmH(55.12"x64.96"x62.99")/1,500Kg(3,306.93lbs.)
MV-9DL
1,250mmLx1,500mmDx1,600mmH(49.21"x59.06"x62.99")/1,400Kg(3,086.47lbs.)
MIRTEC MV-9 3D AOI SMT LINE AOI Details:
The MV-9 series is the first In-Line 2D/3D AOI which utilizes a 15 Mega Camera, 4 way Multi-Frequency 3D Moiré technology and a linear motor system.With simultaneous 2D/3D tests in one head highest productivity is achieved and falls calls are avoided.
Advantages of the 2D/3D inspection
• 3D OMNI-Vision® System
• Achieve ZERO false call by 2D/3D concurrent inspection
• Complete 3D measurement (height, area, tilt, lift, etc.)
• Complete soldering inspection by 6 Phase colour lighting system
• Detect side defects with 10 Mega Side Viewer®
• Non-distortion during image magnification
• Applied 1µm high precision linear motor
The 2D inspection happens with the approved advanced 15 Mega Pixel digital colour camera technology and high resolution telecentric lens. This technology provides the ultimate inspection performance and speed. The optional Side Viewer® Camera System provides enhanced inspection capability through the addition offour Ten Mega Pixel Side View Digital Colour Cameras.
Inspection Performance 2D
• High resolution digital 15 Megapixel colour camera and telecentric lens
• Fast PCB inspection: up to 83 cm²/sec
• MIRTEC’s innovative Quad Angle Lighting System for an enhanced solder joint and solder bridge inspection capability
• The optional 10 MP side Viewer® Camera System for an enhanced detection of complex components.
• Three stage conveyor system with automatic board support and PCB clamping mechanism is designed for
maximum throughput of the line
• Precision motion control systems provide absolute reproducibility and repeatability.
• Powerful OCR Engine provides advanced part marking inspection
By changing the magnification of the Precision Telecentric Lens the resolution of optics system may be scaled from 20 microns/pixel with an incredibly large FOV of (77.7mm x 77.7mm) desired for extremely high speed manufacturing; down to 10 microns/pixel with an FOV of approximately (38.8mm x 38.8mm) which is suitable for high end micro-electronics manufacturing.
MIRTEC’s revolutionary 3D Multi Frequency Quad Moiré Technology, provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow. Fully configured the new MIRTEC MV-7 machines will also feature four 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.
MIRTEC MV-9 3D AOI SMT LINE AOI Picture Show:
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