SMT Placement Solution Smd Mounting Machine Panasonic NPM-D2 Versatile Platform Led Pick and Place Machine For SMT Assembly Line SMT Machine Line
Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15
Whatsapp:+8613424013606,skype:sensenhenhao,wechat:JoyLY0322 
WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .
Also can support some original parts of machine repair.
Successful Experience:
1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World
2. Training More Than 500 Experts and Technician for Customers.
3. Became the Most Reliable Chinese Partner for You.
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
Panasonic NPM-D2 Versatile Platform Technical Parameters :
Model
NPM-W2
Front head/Rear head
Lightweight 16-nozzle head
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head
No head
Lightweight 16-nozzle head
NM-EJM7D
NM-EJM7D-MD
NM-EJM7D
12-nozzle head
Lightweight 8-nozzle head
3-nozzle head V2
Dispensing head
NM-EJM7D-MD
_
NM-EJM7D-D
Inspection head
NM-EJM7D-MA
NM-EJM7D-A
No head
NM-EJM7D
NM-EJM7D-D
_
PCB dimensions
Single-lane *1
Batchmounting
L50mm×W50mm~L750mm×W550mm
2-positin mounting
L50mm×W50mm~L350mm×W550 mm
Dual-lane*1
Dualtransfer(Batch)
L50mm×W50mm~L750mm×W260mm
Dualtransfer
(2-positin)
L50mm×W50mm~L350mm×W260 mm
Singletransfer
(Batch)
L50mm×W50mm~L750mm×W510mm
Singletransfer
(2-positin)
L50mm×W50mm~L350mm×W510 mm
Electric source
3-phase AC 200,220,380,400,420,480 V 2.8 kVA
Pneumatic source *2
0.5 MPa,200 L/min(A.N.R.)
Dimensions *2
W1280mm*3×D2332mm*4×H1444mm*5
Mass
2470 kg (Only for main body:This differs depending on the option confguration.)
Placement head
Lightweight16-nozzle head(Per head)
12-nozzle head(Per head)
Lightweight 8-nozzle head
(Per head)
3-nozzle head V2
(Per head)
High production mode[ON]
High production mode[OFF]
High production mode[ON]High production mode[OFF]
Max.speed
38500cph (0.094s/chip)
35000cph(0.103 s/chip)
32250cph(0.112s/chip)
31250cph(0.115s/chip)
20800cph
(0.173 s/chip)
8320 cph (0.433 s/chip)
6500 cph (0.554s/QFP
Placement accuracy(Cpk≥1)
±40μm/chip
±30μm /chip
(±25μm/chip*6)
±40 μm/chip
±30μm/chip
±30μm/chip
±30μm/QFF012 mm～032 mm
±50μm/QFP012mmUnder
±30μm/QFP
Component dimensions(mm)
0402*7 chip
~L6×W6×T3~L6×W6×T3
03015*7*8/0402*7 chip
0402*7chip~L12×W12×T6.5
0402*7 chip
~L32×W 32×T12
0603 chip to
L150×W25(diagonal152)×T30
Component
supply
Taping
Tape:4/8/12/16/24/32/44/56mm
Tape:4 to 56 mm
Tape:4 to 56/72/88/104m
Max.120(Tape:4,8 mm)
Front/rear feeder cart specifications:Max.120 (Tape width andfederaresubect totheconditions on thelet)
Single tray specifications:Max.86 (Tape with andfederae subectotheconifionson theleft
Twin tray specifcations :Max.60(Tape with andfederae subectotheconifionson theleft
Stick
_
Front/rear feedercart specifcations:Max.30(Single stick feeder)
Single tray specifications :Max.21(Single stick feeder)
Twin tray specifications :Max.15(Single stick feeder)
Tray
_
Single tray specifcations :Max.20
Twin tray specifications:Max.40
Dispensing head
Dot dispensing
Draw dispensing
Dispensing speed
0.16 s/dot (Condition:XY=10 mm,Z=less than 4 mm movement,Noθ rotation)
4.25 s/component (Condition:30 mm x30 mm corner dispensing)*9
Adhesive position acuracy(Cpk≥1)
±75μm/dot
±100μm/component
Applicable components
1608chip to SOP,PLCC,QFP,Connector,BGA,CSP
BGA、CSP
Inspection head
2D inspection head(A)
2D inspection head(B)
Resolution
18μm
9μm
View size
44.4 mm×37.2 mm
21.1mm ×17.6mm
Inspection
processing
time
Solder Inspection*10
0.35 s/View size
Component Inspection*10
0.5 s/View size
Inspection
object
Solder
Inspection *10
Chip component:100 μm×150 μm or more(0603 or more)
Package component:φ150 μm or more
Chip component:80 μm×120 μm or more(0402 or more)
Package component:φ120 μm or more
Component
Inspection*10
Square chip(0603 or more),SOP,QFP(a pitch of 0.4 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume,Trimmer ,Coil ,Connector*11
Square chip(0402 or more),SOP,QFP(a pitch of 0.3 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume ,Trimmer,Coil ,Connector*1
Inspection
items
Solder Inspection*10
Oozing ,blur ,misalignment ,abnormal shape,bridging
Component Inspection*10
Missing ,shift,fipping,polarity ,foreign object inspection*2
Inspection position accuracy(Cpk≥1)*13
±s20 μm
±10 μm
No.of
inspection
Solder Inspection*10
Max.30000 pcs./machine(No.of components :Max.10000 pcs./machine)
Component Inspection*10
Max.10000 pcs./machine
*Placement tact time,inspection time and accuracy values may
differ slightly depending on conditions
*Please refer to the specification booklet for details.
*1:Please consult us separately should you connect it to
NPM-D3/D2/D. It cannot be connected to NPM-TT and NPM.
*2:Only for main body
*3:1880 mm in width if extension conveyors (300 mm)are placed
on both sides.
*4:Dimension D including tray feeder:2570 mm
Dimension D including feeder cart:2465 mm
*5:Excluding the monitor ,signal tower and ceiling fan cover.
*6:±25 μm placement support option.(Under conditions specifed by Panasonic)
*7:The 03015/0402 chip requires a specifc nozzle/feeder.
*8:Support for 03015 mm chip placement is optional.
(Under conditions specified by Panasonic:Placement accuracy±30 μm /chip)
*9:A PCB height measurement time of 0.5 s is included.
*10:One head cannot handle solder inspection and
component inspection at the same time.
*11:Please refer to the specifcation booklet for details.
*12:Foreign object is available to chip components.(Excluding03015 mm chip)
*13:This is the solder inspection position accuracy
measured by our reference using our glass PCB for
plane calibration.It may be affected by sudden
change of ambient temperature.
For SMT Factory Setup, We Can Do for You:
1. We Provide Full SMT Solution for You
2. We Provide Core Technology With Our Equipments
3. We Provide The Most Professional Tech Service
4. We Have Wealthy Experience on SMT Factory Setup
|
Model |
NPM-W2 |
||||||||||||
|
Front head/Rear head |
Lightweight 16-nozzle head |
12-nozzle head |
Lightweight 8-nozzle head |
3-nozzle head V2 |
Dispensing head |
No head |
|||||||
|
Lightweight 16-nozzle head |
NM-EJM7D |
NM-EJM7D-MD |
NM-EJM7D |
||||||||||
|
12-nozzle head |
|||||||||||||
|
Lightweight 8-nozzle head |
|||||||||||||
|
3-nozzle head V2 |
|||||||||||||
|
Dispensing head |
NM-EJM7D-MD |
_ |
NM-EJM7D-D |
||||||||||
|
Inspection head |
NM-EJM7D-MA |
NM-EJM7D-A |
|||||||||||
|
No head |
NM-EJM7D |
NM-EJM7D-D |
_ |
||||||||||
|
PCB dimensions |
Single-lane *1 |
Batchmounting |
L50mm×W50mm~L750mm×W550mm |
2-positin mounting |
L50mm×W50mm~L350mm×W550 mm |
||||||||
|
Dual-lane*1 |
Dualtransfer(Batch) |
L50mm×W50mm~L750mm×W260mm |
Dualtransfer (2-positin) |
L50mm×W50mm~L350mm×W260 mm |
|||||||||
|
Singletransfer (Batch) |
L50mm×W50mm~L750mm×W510mm |
Singletransfer (2-positin) |
L50mm×W50mm~L350mm×W510 mm |
||||||||||
|
Electric source |
3-phase AC 200,220,380,400,420,480 V 2.8 kVA |
||||||||||||
|
Pneumatic source *2 |
0.5 MPa,200 L/min(A.N.R.) |
||||||||||||
|
Dimensions *2 |
W1280mm*3×D2332mm*4×H1444mm*5 |
||||||||||||
|
Mass |
2470 kg (Only for main body:This differs depending on the option confguration.) |
||||||||||||
|
Placement head |
Lightweight16-nozzle head(Per head) |
12-nozzle head(Per head) |
Lightweight 8-nozzle head
(Per head)
|
3-nozzle head V2
(Per head)
|
|||||||||
|
High production mode[ON] |
High production mode[OFF] |
High production mode[ON]High production mode[OFF] |
|||||||||||
|
Max.speed |
38500cph (0.094s/chip) |
35000cph(0.103 s/chip) |
32250cph(0.112s/chip) |
31250cph(0.115s/chip) |
20800cph (0.173 s/chip) |
8320 cph (0.433 s/chip)
6500 cph (0.554s/QFP
|
|||||||
|
Placement accuracy(Cpk≥1) |
±40μm/chip |
±30μm /chip
(±25μm/chip*6)
|
±40 μm/chip |
±30μm/chip |
±30μm/chip
±30μm/QFF012 mm～032 mm
±50μm/QFP012mmUnder
|
±30μm/QFP |
|||||||
|
Component dimensions(mm) |
0402*7 chip
~L6×W6×T3~L6×W6×T3
|
03015*7*8/0402*7 chip |
0402*7chip~L12×W12×T6.5 |
0402*7 chip
~L32×W 32×T12
|
0603 chip to
L150×W25(diagonal152)×T30
|
||||||||
|
Component
supply
|
Taping |
Tape:4/8/12/16/24/32/44/56mm |
Tape:4 to 56 mm |
Tape:4 to 56/72/88/104m |
|||||||||
|
Max.120(Tape:4,8 mm) |
Front/rear feeder cart specifications:Max.120 (Tape width andfederaresubect totheconditions on thelet)
Single tray specifications:Max.86 (Tape with andfederae subectotheconifionson theleft
Twin tray specifcations :Max.60(Tape with andfederae subectotheconifionson theleft
|
||||||||||||
|
Stick |
_ |
Front/rear feedercart specifcations:Max.30(Single stick feeder)
Single tray specifications :Max.21(Single stick feeder)
Twin tray specifications :Max.15(Single stick feeder)
|
|||||||||||
|
Tray |
_ |
Single tray specifcations :Max.20
Twin tray specifications:Max.40
|
|||||||||||
|
Dispensing head |
Dot dispensing |
Draw dispensing |
|||||||||||
|
Dispensing speed |
0.16 s/dot (Condition:XY=10 mm,Z=less than 4 mm movement,Noθ rotation) |
4.25 s/component (Condition:30 mm x30 mm corner dispensing)*9 |
|||||||||||
|
Adhesive position acuracy(Cpk≥1) |
±75μm/dot |
±100μm/component |
|||||||||||
|
Applicable components |
1608chip to SOP,PLCC,QFP,Connector,BGA,CSP |
BGA、CSP |
|||||||||||
|
Inspection head |
2D inspection head(A) |
2D inspection head(B) |
|||||||||||
|
Resolution |
18μm |
9μm |
|||||||||||
|
View size |
44.4 mm×37.2 mm |
21.1mm ×17.6mm |
|||||||||||
|
Inspection
processing
time
|
Solder Inspection*10 |
0.35 s/View size |
|||||||||||
|
Component Inspection*10 |
0.5 s/View size |
||||||||||||
|
Inspection
object
|
Solder
Inspection *10
|
Chip component:100 μm×150 μm or more(0603 or more)
Package component:φ150 μm or more
|
Chip component:80 μm×120 μm or more(0402 or more)
Package component:φ120 μm or more
|
||||||||||
|
Component
Inspection*10
|
Square chip(0603 or more),SOP,QFP(a pitch of 0.4 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume,Trimmer ,Coil ,Connector*11
|
Square chip(0402 or more),SOP,QFP(a pitch of 0.3 mm or more)
CSP,BGA,Aluminum electrolysis capacitor,Volume ,Trimmer,Coil ,Connector*1
|
|||||||||||
|
Inspection
items
|
Solder Inspection*10 |
Oozing ,blur ,misalignment ,abnormal shape,bridging |
|||||||||||
|
Component Inspection*10 |
Missing ,shift,fipping,polarity ,foreign object inspection*2 |
||||||||||||
|
Inspection position accuracy(Cpk≥1)*13 |
±s20 μm |
±10 μm |
|||||||||||
|
No.of
inspection
|
Solder Inspection*10 |
Max.30000 pcs./machine(No.of components :Max.10000 pcs./machine) |
|||||||||||
|
Component Inspection*10 |
Max.10000 pcs./machine |
||||||||||||
Panasonic NPM-D2 Versatile Platform Details:
The NPM-W2 amplifies the original NPM-W capabilities with a 10% throughput boost and 25% more accuracy. It also integrates new innovations like our incomparable Multi Recognition Camera. Combined, these features extend the component range down to the 03015mm microchip, yet preserve capability up to 120x90mm components up to 40mm tall and nearly 6” long (150mm) connectors.
Featuring a revolutionary Multi Recognition Camera that uniquely combines three separate imaging capabilities into a single system: 2D alignment, component thickness inspection, and 3D coplanarity measurement.
Features:
▶Higher productivity and quality with printing, placement and inspection process integration
▶For larger boards and larger PCBs up to a size of 750 x 550 mm with component range up to L150 x W25 x T30 mm
▶Higher area productivity through dual lane placement
▶Quick-change feeder carts and nozzle banks
▶Lightweight 16-nozzle head (for 77,000 CPH) with increased placement accuracy to 25um (cpk ≥ 1.0)
Panasonic NPM-D2 Versatile Platform Picture Show:
EXHIBITION:
SMT LINE:
