Heller 1936 MKV Reflow Oven SMT Reflow Oven

Product Description

Whatsapp:+8613728632793, skype:Joaquin Xie,wechat:Joaquin15

WE are smt support provider for smt machine parts and equipment .such as feeder,nozzle , feeder storage cart smt reel rack , smt grease , solder paste mixer, smd counter, KIC thermal profiler,smt tape and so on .

Also can support some original parts of machine repair.

Successful Experience:

1. We Have Been Helping Customers To Build a Lot of New Factories Around the World.Meraif's Customer In 35 Countries Around the World

2. Training More Than 500 Experts and Technician for Customers.

3. Became the Most Reliable Chinese Partner for You.

For SMT Factory Setup, We Can Do for You:

1. We Provide Full SMT Solution for You

2. We Provide Core Technology With Our Equipments

3. We Provide The Most Professional Tech Service

4. We Have Wealthy Experience on SMT Factory Setup

Heller 1936 MKV Reflow Oven SMT Reflow Oven Technical Parameters :

Model	1936 MK5 (Air)	1936 MK5 (Nitrogen)
Power Input	3-Phase480volts
Breaker Size	100 amps @ 480v
kW	9 - 15 Continuous
Typical Run Current	30 - 35 amps @ 480v
Optional Power Inputs Available	208/240/380/400/415 VAC
Frequency	50/60 Hz
Sequential Zone Turn On	S	S
Overall Oven Dimensions	232" (590cm) L x 60” (152cm) W x 63” (160cm) H
Typical Net Weight	6380 lbs. (2900 kg)	7180 lbs. (3280 kg)
Typical Shipping Weight	7875 lbs. (3580 kg)	8980 lbs. (4080 kg)
Typical Shipping Dimension	244” x 73” x 83”	620 x 185 x 210 cm
Overall Oven Dimensions	232" (590cm) L x 60” (152cm) W x 63” (160cm) H
Height From Floor	35.5" + 2.0" (90 cm + 5 cm)
Maximum PCB Width	22" (55 cm)
Space Required Between PCB's	0.0" (0.0 cm)
Conveyor Length On-Load	18" (46 cm) *	3" (7.5 cm) *
Conveyor Length Off-Load	18" (46 cm) *	3" (7.5 cm) *
Heated Tunnel Length	135" (343 cm)
Process Clearance Above Mesh Belt	2.3" (5.8 cm)

Heller 1936 MKV Reflow Oven SMT Reflow Oven Details:

Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).

Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow
Excellent results demonstrated for wafer bumping application in horizontal reflow oven
Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents
Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps
No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution
Feasibility has been demonstrated with production grade oven
Extensive engineering efforts in safe, precision delivery of formic acid and abatement

Fluxless Reflow Advantages

Can use any reflow profile (e.g., tent or soak profile) with formic acid
Can adjust formic acid profile in oven in conjunction with thermal reflow profile
Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards
Includes Formic acid abatement systems for Green Process Solution
Includes real time formic acid concentration monitor system

Heller 1936 MKV Reflow Oven SMT Reflow Oven Picture Show:

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